Encapsulation and Overmolding with RIM provides for reliable, structural ‘one-piece’ solutions wherever added functionality is needed or where sensitive equipment needs protection from the environment. Components to be encapsulated are fully or partially surrounded by the molded part which provides for the structural and cosmetic properties of the finished unit.
Encapsulation with RIM: » Circuit Boards – will not melt PCBs » Batteries – will maintain battery’s capacity » Antennas – will maintain or improve radio signal » Magnets – embed or hide magnets in the molded part » Glass – directly molded structural frames with added functions » Metal Rods, Bolts & Clips – anchored right into the part » Threaded Inserts – for attachments of assembly parts
Why it works with RIM:
The low exothermic heat, and low process pressure produced, allows for encapsulation of sensitive circuit boards and batteries while the low viscosity of the material ensures that even the most detailed geometries are being filled out.
Polyurethane, the material created by the RIM process, is also a natural glue and will adhere to almost all other materials, ensuring an excellent bond. No matter if you need impact resistance, chemical resistance or the part to float in water – chances are, there is a RIM material to meet the requirements.
